If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time . At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID: 73831 Description When you join our team in Newbury Park, you’ll join a uniquely collaborative, multi-discipline engineering community who support each other working across our domestic design centers creating cutting-edge products for global markets. You’ll be paired with a mentor to help support you as an integral part of a team responsible for designing custom parts. Skyworks is one of the most cutting-edge and impactful players helping people connect across the globe. We are seeking engineering talent with expertise in RF/microwave, RFIC design, and PA product development. You will be part of a multi-discipline team developing PA, RF switches, and front-end modules for the high volume and fast-paced cellular handset market. You will have opportunities to participate in all phases of product development, including product definition, architecture, system, transistor-level circuit design, MCM design, layout/layout supervision, lab debug, and production support. Responsibilities Work with a multidisciplinary team of PA, RF switch, LNA, Filter, and multi-chip module (MCM) designers to support fully integrated front-end module designs. Drive team effort for tape-outs/BOM lock to meet project milestone/customer deliverable. Work with PA/SW/LNA/HBT die designers to come up with die size, pinout. Understand register maps and be able to translate it to SWIPI table, MTS states. Review/Assist in collecting large volume Automated Test data, Mini-CM/Full-CM review, Characterization data and drive yield improvement effort with Product Engineer. Organize lab tuning, bench data measurement activity for product development as well as customer samples. Drive first level of coordination of BOM with program managers. Qualifications Required Experience and Skills Bachelor's Degree in Electrical Engineering + 2 years' experience or MSEE. Hands-on experience in MCM artwork, EM simulation, and lab debug and tuning. Good communication skills both verbal and written and logic reasoning skills, capable of breaking down complex problems, setting priorities, reporting progress, and executing to schedule. Capability of breaking down customer specs to sub-component level i.e. die/filter specs. Strong circuit simulation skills utilizing Agilent ADS/GoldenGate/Spectre RF and 2.5/3D EM tools such as Momentum, Sonnet, or HFSS. Solid understanding of RF concepts such as impedance matching, impedance transformation, distributed systems, passive RLC and resonant circuits, noise, linearity, bandwidth, and stability. Preferred Experience and Skills Good understanding of RF systems and familiarity with wireless standards including 3GPP cellular 2/3/4/5G/LTE, WiFi, GPS, Bluetooth. Solid understanding of device and process technologies. Experience in system architecture, circuit topology, and MCM floorplan. Experience in FEM product development and customer interaction. Good understanding of acoustic filters such as SAW, BAW filters. Experience in co-sim of multiple technologies such as digital, analog, and RF circuit. Familiar with lab instruments including Network Analyzers, Spectrum Analyzers, Signal Generators, RF Probe Stations, Noise Figure Analyzers, and Load-pull Tuners.
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